晶圆ID打标设备

具有激光功率自动补偿功能

可用于晶圆ID(OCR)打标

打标字体：OCR/B412/SEMIT7/雕刻模式

配备FOUP/机械手/预对准器/FFU/打标头&集尘模块

配备自动振镜校正功能和自动偏移补偿功能

一般光斑大小是90um

Equipped with laser power automatic compensation function

Can be used for Wafer ID(OCR) marking. 

Marking font : OCR / B412 / SEMIT7 / engraving mode

Equipped with FOUP opener/robot/pre-aligner/FFU/marking head & particle suction units

Equipped with automatic scanner calibration and automatic offset compensation. 

General spot size is about 90um. 

参数配置

功能描述

适用产品：8英寸、12英寸 硅晶圆

主要功能：实现晶圆OCR激光打标

进出料方式：FOUP 到 FOUP

尺寸：L2100 * W1400 * H1800mm

Applicable products: 8-inch, 12 inch silicon wafers. 

Main function: To achieve laser marking for wafer OCR. 

Import and export method: FOUP to FOUP

Size: L2100 * W1400 * H1800mm